FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Current Sensors such as high-quality pre-amp

such as high-quality pre-amp

It is suitable for EIA RS-232 applications

This is a SCREWDRIVER BLADE

Keyed mounting with double flats

FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Current Sensors such as high-quality pre-ampThis is a Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13. 5 C W, 22 mm, 27 mm, 27 mm product from FISCHER ELEKTRONIK with the model number ICK BGA 27 X 27 X 22Product details Packages Cooled BGA Thermal Resistance 13. 5C W External Height Metric 22mm External Width Metric 27mm External Length Metric 27mm External Diameter Metric Heat Sink Material Aluminium External Height Imperial 0. 87" External Width Imperial 1. 06" External Length Imperial