ABL HEATSINKS BGA-STD-010 Heat Sink, For Ball Grid Array, Standard, BGA, 27 °C/W, 10 mm, 13.5 mm, 13 mm Hosa Technology BNC-58-101 Does not corrode copper or

Does not corrode copper or its alloys

front-loading design for quick and easy setup

Fits Flat Screen Monitors up to 45"

Designed for Projectors

ABL HEATSINKS BGA-STD-010 Heat Sink, For Ball Grid Array, Standard, BGA, 27 °C/W, 10 mm, 13.5 mm, 13 mm Hosa Technology BNC-58-101 Does not corrode copper orThe BGA STD 010 is a 13mm standard Heat Sink with aluminium, black anodized, thermal tape, 27C W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high